In the next 2 to 3 years, the company will work with CIDM partners and leading international semiconductor companies and research institutions to develop the following integrated circuit products and technologies, covering 0.18um to 28nm process technology nodes:
Logic IC
Digital Signal Processor, DSP
Field Programming Gate Array, FPGA
System on Chip, SOC
Micro-Control Unit, MCU
embedded MCU
Power Management IC, PMIC
Diver
Specialty Memory
Power MOSFET, IGBT
Analog IC
MEMS
CMOS mage Sensor, CIS
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